A crucial component of the iPhone 7s Plus - CYDIAPLUS.com

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Friday, 25 August 2017

A crucial component of the iPhone 7s Plus



We just got to know a new component of the iPhone 7s Plus , one of the three devices that Apple will launch this September. This year is going to be a crazy year, we will witness a historic event for Apple: will be presenting three iPhone and two different generations. It's going to be a keynote full of surprises.

Today it has leaked an image of what could be the motherboard of the iPhone 7s Plus , confirming rumors that there will be three devices in the September keynote. Each time we are closer to the keynote, and our hearts beat nervously awaiting the arrival of that day.


The motherboard of the iPhone 7s Plus in pictures


This image we deduce that is the motherboard of the iPhone 7s Plus because it maintains the same holes for the screws as the motherboard of the iPhone 7 Plus, remember that the generation of Apple maintains exactly the same design but with better hardware components.

In this image the motherboard does not have the components connected , but the connectors it has let the iPhone 7s Plus work with an A11 chip and an Intel modem. It is easy to know which processor will go in that connector, because there are images on the A11 chip both above and below. We just have to see an image next to the other to know that the holes match.


The A11 chip and the Intel modem


From this chip we know that it is designed in a technology of 10 nanometers, is produced by TSMC and is undoubtedly faster than the A10 Fusion chip present in the iPhone 7 and iPhone 7 Plus.

Due to the constant battles of Apple and Qualcomm we assume that the company opted to switch modem supplier and choose Intel as the main developer, something we already saw in the iPhone 7 and iPhone 7 Plus.

Via | Macrumors.com 

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